HN-8820 Potting Gel | 1:1 Mix Ratio | High Thermal Conductivity | UL94 V-0
Product Overview for Thermally Conductive Potting Compound:
HN-8820 is a thermally conductive silicone encapsulant that safeguards sensitive electronics against overheating and environmental damage. It is simple to use and highly reliable.
Performance Highlights for Thermally Conductive Potting Compound
Thermal conductivity: 2.0 W/m·K
V-0 self-extinguishing
Good adhesion to most substrates
Resists thermal cycling
Technical Parameters for Thermally Conductive Potting Compound:
• Mix Ratio: 1:1
• Pot Life: 60–120 min
• Cure Time: 2–4 hrs @ 25°C
• Density: 2.36 g/cm³
Applications for Thermally Conductive Potting Compound:
Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.
Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.
Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.
FAQ for Thermally Conductive Potting Compound:
Q: Is HN-8820 flexible?
A: Yes, it remains elastic.
Q: Can I heat cure it?
A: Yes, at 80°C for 10–20 min.
Q: Does it contain solvents?
A: No, it’s solvent-free.
Q: Is it reusable after opening?
A: Reseal tightly; use within shelf life.
Q: Can it be used for high-power devices?
A: Yes, thanks to its high thermal conductivity.
Product Tags:
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Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules Images
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